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¡¶ Advanced Adhesives in Electronics ¡·

Author£º Alam & Bailey
Publisher£º

Abstract:

 Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications
   
     Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems
   
     Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
   
   

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